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| ■光通信: フォトダイオード |
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| ■製品概要/Product Overview |
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The PDCS38B is a fully qualified high speed photodiode chip with a coplanar pad layout and an optical aperture with a diameter of 38 ?m. The bottom illuminated photodiode is optimized for single-mode data- and telecom applications up to 12.7 Gb/s and offers excellent responsivity and a high speed response from 1260 to 1620 nm.
The photodiode has a low capacitance and achieves full speed at a bias voltage of only 1.5 V. The pad metallization is optimized for wire-bonding or flip-chip soldering with the ground-signal-ground pad structure allowing direct bonding to any TIA layout.
In addition, a backside metallization can be added to solder the die to a submount. |
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PDFファイル:87kb
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| ■特徴/Key Features |
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High responsivity: 0.9 A/W
Low dark current: 3 nA
Low capacitance: 150 fF
Low bias voltage: 1.5 V
Pad layout allows easy bonding to any TIA pad design
Support pads for flip-chip assembly
Bottom illuminated device |
| ■アプリケーション/Application |
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WDM / CWDM / DWDM
10 Gb/s SONET / SDH
10 G Ethernet / Fiber Channel
12 GHz analog links |
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